Integrated circuit package
US4441119A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 15, 1981 |
| Grant date | Apr 3, 1984 |
| Priority date | — |
| Expiry date | Jan 15, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1053
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved integrated circuit package (10) includes a cover (12), an intermediate subassembly (14) and a bottom subassembly (16). The intermediate and bottom subassemblies (14, 16) include lead frames (48, 22) respectively embedded therein, as well as openings which define a cavity for a semiconductor chip. The external lead pins (24) of the bottom subassembly (16) permit interconnection of the package with a circuit board or the like, while the external contacts (50) of the intermediate subassembly (14) cooperate with openings (62) in the cover to provide integral socket connections for other semiconductor packages or electrical components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.