On-line inspection method and system for bonds made to electronic components
US4441248A · kind A · utility
41Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 1982 |
| Grant date | Apr 10, 1984 |
| Priority date | — |
| Expiry date | Dec 2, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13034
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
On-line inspection of electric characteristics of a semiconductor device can be achieved during a step of bonding a lead wire to a chip surface of the semiconductor device in the process of fabricating an electronic component, by the use of a circuit arrangement formed between a lead wire fed from a bonder and connectors serving as electric terminals when the chip is mounted thereon to be made into an electronic component, and by the application of electric power thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.