Stabilizing mixture for a chemical copper plating bath
US4443257A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 15, 1983 |
| Grant date | Apr 17, 1984 |
| Priority date | — |
| Expiry date | Feb 15, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/40
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An aqueous solution for electroless autocatalytic copper plating, containing a source of cupric ions, a source of hydroxylic ions, a reducing agent and a complexing agent in such a quantity as to render soluble the cupric ions in an alkaline medium, which further contains a stabilizing mixture formed by allylthiourea, at least a ferrocyanide of alkali metal or of ammonium ion, and at least an octylphenylether of ethylene polyoxide with 9-10 moles of ethylene oxide for each mole of octylphenol, the said three stabilizing compounds exerting a synergical action. This solution shows a very good stability and produces copper deposits having clear and brilliant appearance and good ductility properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.