Heat-moldable laminate and process for molding said laminated structures
US4443507A · kind A · utility
34Cited by
0References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 1982 |
| Grant date | Apr 17, 1984 |
| Priority date | — |
| Expiry date | Aug 30, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A heat-moldable laminate comprising at least one thermoplastic resin layer, at least one fiber reinforced cured thermosetting resin layer, and at least one slippage layer interposed therebetween and bonding the resin layers, said slippage layer comprising a thermoplastic resin and said slippage layer being capable of being molten at lower temperatures than the moldable temperature of the thermoplastic resin layer, and a process for molding the heat-moldable laminate to produce a molded article having excellent strength and rigidity is disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.