Mushroom casing composition and process
US4443969A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 14, 1982 |
| Grant date | Apr 24, 1984 |
| Priority date | — |
| Expiry date | Apr 14, 2002 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA01G18/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
In the cultivation of mushrooms from an underlying bed containing mushroom spores, novel compositions and processes are provided for a casing layer which is placed over the compost layer containing spawning mycelium. A hydrophilic, thermosetting prepolymer resin is mixed in with a casing substrate, preferably Canadian peat, other optional additives and sufficient amount of water to form a slurry and the mixture is allowed to cure to a spongy block. The cured material is then pulverized and deposited as a casing layer over the compost layer. Because of the high water retention qualities of this material, watering the mushroom beds is reduced by a factor of three or more, thereby reducing operation and production costs, as also the incidence and severity of disease and displeasing blemishes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.