Patent · US Expired

Polyamide release film for sheet molding compound

US4444829A · kind A · utility

20Cited by
8References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 22, 1980
Grant dateApr 24, 1984
Priority date
Expiry dateDec 22, 2000

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/31725
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

Disclosed is a polyamide film of low crystallinity suitable for use in the manufacture of sheet molding compound (SMC). The sheet is produced from a blend comprising a polyamide selected from the group consisting of polyepsiloncaprolactam, polyhexamethylene adipamide or mixtures thereof, and about 10 to 30 wt. %, based on the total weight of said blend, of a polyolefin compound, or copolymer thereof, such as ethylene-vinyl acetate copolymer. The film has a tear strength of at least about 400 grams in the longitudinal direction as measured by ASTM D-1004-66.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.