Adherent metal coatings on rubber-modified epoxy resin surfaces
US4444848A · kind A · utility
34Cited by
25References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 4, 1982 |
| Grant date | Apr 24, 1984 |
| Priority date | — |
| Expiry date | Jan 4, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12944
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming adherent metallized coatings on a substrate which is useful for the manufacture of printed circuit boards as well as other metal coated articles involves providing the substrate with a rubber-modified epoxy surface or coating, sputter etching at least 50 A. from the surface followed by vacuum depositing an adherent thin metal film of Cr, Ni, Ni-V alloy, Pt, Pd or Ti onto the substrate. Another metal layer is then provided over the adherent thin film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.