Process for using positive-working resist materials to form negative resist pattern on substrate
US4444869A · kind A · utility
11Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 25, 1981 |
| Grant date | Apr 24, 1984 |
| Priority date | — |
| Expiry date | Nov 25, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/163
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An improved positive-working resist material capable of forming on a substrate either a positive resist pattern or a negative resist pattern. The positive-working resist material comprises a positive-working resist resin having incorporated therein one or more photochromic compounds, such as spiropyrans, triphenylmethane dyes, anils and the like. A positive or negative resist pattern having a remarkably improved definition can be obtained. The use of such a positive-working resist material in the formation of a negative resist pattern on the substrate is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.