Room temperature curing composition
US4444974A · kind A · utility
25Cited by
1References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 1982 |
| Grant date | Apr 24, 1984 |
| Priority date | — |
| Expiry date | Dec 6, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S528/901
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A room temperature curing composition comprising a polyoxyalkylene polymer having a silicon-containing hydrolyzable group and a hydrolyzable silicon compound as a stabilizer, which is stable in a closed system and is curable by exposure to moisture. The stabilizer has a higher hydrolysis reactivity than the polyoxyalkylene polymer and serves as a dehydrating agent, and therefore the storage stability can be remarkably improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.