Method of forming composite surface on a dielectric substrate
US4445979A · kind A · utility
3Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 1983 |
| Grant date | May 1, 1984 |
| Priority date | — |
| Expiry date | Aug 4, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09363
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for providing a dielectric substrate with a composite surface comprising a metal plated portion side-by-side an unplated portion. The process includes: depositing a metallic film over the surface of the substrate; removing a narrow band of the film to electrically isolate one portion of the film from another; immersing the substrate in an electroplating bath capable of dissolving the film; cathodizing one of the film portions in the bath to electroplate that portion while the other portion dissolves therein to expose the underlying substrate. The thusly exposed substrate may subsequently be painted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.