Method for producing a steel lithographic plate
US4445998A · kind A · utility
31Cited by
9References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 1981 |
| Grant date | May 1, 1984 |
| Priority date | — |
| Expiry date | Dec 2, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S205/921
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for producing a metal substrate for a lithographic plate is provided herein by treating the substrate having the thickness in the range of 50 to 400 .mu.m. The said substrate is electrochemically, chemically or mechanically treated in order to provide an average surface roughness in the range of 0.1 to 3 .mu.m, followed by a surface treatment such as plating or chemical treatment, and then followed by a conventional hydrophilic treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.