Patent · US Expired

Crossover construction of thermal-head and method of manufacturing same

US4446355A · kind A · utility

8Cited by
7References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 22, 1982
Grant dateMay 1, 1984
Priority date
Expiry dateFeb 22, 2002

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49099
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A crossover construction of a thermal-head is which the thermal-head comprises: a substrate of insulating material; a plurality of heat elements disposed side by side in one row on said substrate; a plurality of lower thin film conductor patterns each of which connects to each of said heat elements and extends in direction X; an insulating layer disposed over said lower conductors; a plurality of upper conductor patterns disposed in parallel in another direction Y on said insulating layer so as to form a crossover on said substrate, said upper and lower conductors being selectively connected together through openings of said insulating layer, wherein said insulating layer and said upper conductors comprise printed and cured paste of insulating material and conductive material, respectively, each paste being of the low temperature curing type which can be cured at a temperature low enough not to affect the resistance of said thin film lower conductors, and a metallic layer of low resistance is coated on each of said upper conductors.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.