Apparatus for continuously depositing a layer of a solid material on the surface of a substrate brought to a high temperature
US4446815A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 1982 |
| Grant date | May 8, 1984 |
| Priority date | — |
| Expiry date | Dec 14, 2002 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/453
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The apparatus comprises a nozzle (2) having three converging tuyeres (3, 4, 5) which project the reagents (SnCl.sub.4 and H.sub.2 O) in the gaseous phase onto the substrate to be plated. Deflector members (6a, 6b), which are adapted to channel the gases between themselves and the substrate, extend on either side of the nozzle (2). The surface (51) of the deflector member (12) which extends in the opposite direction to the direction of movement of the substrate with respect to the nozzle is parallel to the substrate, and the edge (53) which it forms at an acute angle with the extended external wall (5b) of the third tuyere (5) is transversely offset in the direction of the said movement with respect to the axial median plane of the tuyere (3). On the other hand, the surface (52) of the second deflector member (5a) forms a blunt edge (54) with the corresponding longitudinal wall (4b) of the second tuyere. The opening of the nozzle between the edges (53, 54) is therefore effectively bent and the gases emerging therefrom are regularly deflected in the direction of movement of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.