Substrate with multiple type connections
US4447857A · kind A · utility
78Cited by
8References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 9, 1981 |
| Grant date | May 8, 1984 |
| Priority date | — |
| Expiry date | Dec 9, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A novel substrate is disclosed which can mount either flip-chip solder bonded IC chips or wire bonded chips, or both chips, or a single chip having both solder bonds and wire bonds is disclosed. The substrate has an array of solder pads which will accept solder bonds. Those pads which are to be used for wire bonding have mounted thereon a trimetallic pedestal. Each pedestal has a layer of solder metal bonded to the solder pad, a top layer metal suitable for wire bonding, such as, aluminum or gold, and an intermediate layer of metal, such as nickel, which is impervious to both solder metal and the top layer metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.