Telescoping thermal conduction element for cooling semiconductor devices
US4448240A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 20, 1982 |
| Grant date | May 15, 1984 |
| Priority date | — |
| Expiry date | Dec 20, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal bridge element for use in a semiconductor package to conduct heat from a semiconductor device to a cold plate or cap located in close proximity to the device having a first plate to be placed in contact with a semiconductor device surface, a first spiral strip of heat conductive material joined to the first plate, a second plate to be placed in contact with a heat sink surface or cap spaced from the device surface, and a second spiral strip of thin heat conductive material interleaved with the first spiral strip and in partially overlapping telescoping relation, the second spiral strip joined to the second plate, and a means to bias the first and second plate outwardly relative to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.