Heat resistant resin and process for producing the same
US4448844A · kind A · utility
13Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 1983 |
| Grant date | May 15, 1984 |
| Priority date | — |
| Expiry date | Jul 28, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A heat resistant resin produced by reacting (A) a polyamideimide resin with (B) an alcohol component and (C) an acid component with heating is soluble in a cresol type solvent and gives coatings excellent in heat resistance, thermal shock resistance, wear resistance, resistance to hydrolysis, etc., suitable for enamelled wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.