Method and apparatus for encapsulation of chemically sensitive field effect device
US4449011A · kind A · utility
9Cited by
4References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 8, 1982 |
| Grant date | May 15, 1984 |
| Priority date | — |
| Expiry date | Jan 8, 2002 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N27/414
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Semiconductor chips carrying chemically sensitive field effect devices are encapsulated by tape automated bonding techniques, wherein one tape layer has a beam lead pattern disposed thereon which terminates in the chip bonding pad pattern over an opening in the tape. A tape layer for sealably covering the beam lead pattern and the chip has openings which are respectively coincident with the chemically selective membrane systems of the field effect devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.