Heat-producing elements with heat pipes
US4449576A · kind A · utility
65Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 27, 1981 |
| Grant date | May 22, 1984 |
| Priority date | — |
| Expiry date | Nov 27, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20672
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The PC-boards are contained in sealed enclosures, and serially effective heat pipe systems conduct thermal energy from the respective sources of development (e.g., power transmitters) to the top and from there to a heat pump system. Stacking such units and operating the heat transfer partially in parallel is disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.