Vertical wall elevated pressure heat dissipation system
US4449580A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1981 |
| Grant date | May 22, 1984 |
| Priority date | — |
| Expiry date | Jun 30, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipating system for cooling circuit chips or modules is described. The disclosed system includes circuit chips or modules which are vertically mounted, a gas at an elevated pressure being contained within an encased module for providing an enhanced thermal coupling between the chips or modules contained therein, and the walls of the encased module, whereby heat removal from the chips or modules is increased. This enhanced thermal coupling is combined with a reduction in the temperature of the walls of the encased modules so as to reduce the thermal resistance between the surrounding gas and the chips or modules to be cooled, whereby heat removal from the circuit chips or modules is substantially increased.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.