Temperature control for wafer polishing
US4450652A · kind A · utility
134Cited by
5References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 4, 1981 |
| Grant date | May 29, 1984 |
| Priority date | — |
| Expiry date | Sep 4, 2001 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/14
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wafer workpiece polishing temperature control method and apparatus are provided wherein wafers are mounted upon a rotatable pressure plate assembly positioned in rotatable contact with a turntable assembly supported polishing pad, the turntable assembly having internal fluid cooling means, the wafer polishing temperature control being achieved through responsive closed loop electromechanical means activated by variation of polishing pressure upon the wafers and the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.