Package
US4450960A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 30, 1982 |
| Grant date | May 29, 1984 |
| Priority date | — |
| Expiry date | Aug 30, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S206/832
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Container package for transporting a plurality of silicon wafers for shipment as well as preventing contamination thereof. The container wafer package includes a cassette having two sides, an end, and an H-bar including an upper ramp support and a lower round support with the bar being reinforced by a partially cylindrical rod, a package bottom including four sides, a female trough surrounding the sides, hook latches, four internal side dividing members, and orthogonal feet for stacking; and the package top including four sides, a male trough to mate with the female trough, configured independent flexible grooved fingers, and orthogonal feet for stacking where the cassette is positioned by internal side dividers in the top and bottom packages for secure placement. The three components provide that the cassette mates between the top and bottom packages, the wafers mate in the cassette and with the top fingers, the top and bottom packages mate between the trough, and the hook ends secure the top and bottom packages together with also securing of the cassette and wafers therein. The side of the package is smooth, providing for a flush perimeter for taping. The interlocking orthogonal …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.