Patent · US Expired

Process for preparation of metal vessels

US4451316A · kind A · utility

4Cited by
7References
5Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 21, 1982
Grant dateMay 29, 1984
Priority date
Expiry dateOct 21, 2002

Classification

  • Technology area (CPC F)Mechanical Engineering; Lighting; Heating
  • CPC primaryF16B11/006
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

Disclosed is a process for the preparation of metal vessels, which comprises lap-bonding both the circumferential end portions of upper and lower members, each consisting of a seamless formed metal cup, through a layer of a hot adhesive interposed therebetween, wherein a high frequency induction heating coil is arranged so that the coil covers a part, smaller than the semicircle, of the circumferential portion to be formed into a seam, which circumferential portion consists of said end portions engaged with each other through the hot adhesive layer, electricity is applied to the heating coil to induce an eddy current passing through said end portions and the circumferential portion and the heating coil are rotated relatively to each other, whereby both the end portions are heated and a seam is formed by heat bonding.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.