Radiation-sensitive poly(amic acid) polymer composition
US4451551A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Dec 17, 1981 |
| Grant date | May 29, 1984 |
| Priority date | — |
| Expiry date | Dec 17, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S522/904
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A light- or radiation-sensitive polymer composition comprising (a) a poly(amic acid) having as a major component a repeating unit of the formula: ##STR1## (b) one or more light- or radiation-sensitive compounds having an amino group and an aromatic azide group or aromatic sulfonylazide group in one molecule, and if necessary (c) one or more photosensitizers and/or amine compounds having at least one unsaturated bonding, and/or (d) one or more compounds having at least two unsaturated bonding in one molecule, is highly sensitive to light and radiation and can give a precise relief pattern on a substrate. Further, a finally obtained polyimide film is excellent in heat resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.