Lead frame device including ceramic encapsulated capacitor and IC chip
US4451845A · kind A · utility
25Cited by
3References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 1981 |
| Grant date | May 29, 1984 |
| Priority date | — |
| Expiry date | Dec 22, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to an IC device of the ceramic encapsulated type wherein a power supply pulse dampening capacitor is embodied within the IC housing. The device is characterized by the utilization of a chip capacitor bonded to the floor of a recess formed within the housing, which capacitor forms a platform supporting the IC device. Leads between the capacitor and the power supply terminals of the circuit may be maintained at extremely short lengths, whereby inductances are minimized and relatively small capacitors effectively damp power supply pulses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.