Patent · US Expired

Method for bonding insulator to insulator

US4452624A · kind A · utility

15Cited by
1References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 21, 1982
Grant dateJun 5, 1984
Priority date
Expiry dateDec 21, 2002

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC04B2237/86
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

A method for making an airtight seal between a pair of insulator elements, uch as glass plates, without destroying any fine structure etched in the insulator elements. A thin metal film is deposited on one of the elements to be sealed and then placed in intimate contact with the other element to be sealed. The elements are then heated to a temperature well below their softening point, but high enough to significantly enhance the ion mobility in the insulator. A voltage is applied across the interface and the resulting anodic reaction consumes the film at the interface while producing a strong hermetic bond between the insulator elements.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.