Method for predetermining peel strength at copper/aluminum interface
US4452664A · kind A · utility
9Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 1, 1983 |
| Grant date | Jun 5, 1984 |
| Priority date | — |
| Expiry date | Aug 1, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/11
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A low temperature (about 0.degree. C. to about 100.degree. C.) method is disclosed for forming an ultrathin film of copper on an aluminum carrier sheet. By this method, which employs matte finish aluminum foil, the peel strength for separating the aluminum carrier from the copper film can be preset at a desired value between 0.1 and 2 pounds per inch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.