Solder handling
US4453662A · kind A · utility
2Cited by
4References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 10, 1982 |
| Grant date | Jun 12, 1984 |
| Priority date | — |
| Expiry date | Feb 10, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3478
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Solder wire attached along its length to a base metal by a small quantity of solder melted at the solder-base metal juncture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.