Palladium plating procedure
US4454010A · kind A · utility
6Cited by
2References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 30, 1982 |
| Grant date | Jun 12, 1984 |
| Priority date | — |
| Expiry date | Aug 30, 2002 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/52
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A palladium electroplating process is described in which a unique compound is used to supply palladium to the electroplating bath. The procedure is particularly useful where a polyamine such as 1,3-diaminopropane is used as the complexing agent for palladium in a palladium electroplating bath. The unique compound is palladium-1,3-diaminopropanedichloride which is highly stable, can be made in pure form, and is readily soluble in water, aqueous solutions, and typical palladium baths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.