Etched article
US4454014A · kind A · utility
19Cited by
10References
58Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 3, 1983 |
| Grant date | Jun 12, 1984 |
| Priority date | — |
| Expiry date | Jan 3, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12465
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a metallic pattern on a substrate is disclosed. The method consists of depositing an adhesive and/or plating base material on a substrate upon which a narrow self-supporting border of photoresist is applied. An anodic layer is then deposited and the photoresist removed. The adhesive and plating base material is etched in those areas previously covered by the photoresist and fresh photoresist applied to encapsulate those areas of the anodic layer which form the final pattern of interest. The unwanted anodic material is then etched and the photoresist removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.