Process for generating conductive patterns
US4454167A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 6, 1982 |
| Grant date | Jun 12, 1984 |
| Priority date | — |
| Expiry date | Jul 6, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0568
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for generating high resolution conductive patterns on an insulating substrate. A photosensitive resin coating applied to the surface of a substrate is exposed to a suitable light source through a mask. The unexposed portion of the coating defines the desired conductive pattern which is then coated with a low temperature melting glass powder. The substrate is fired to sinter the glass pattern and fuse it to the substrate. The substrate is then coated with a slurry of fine metal particles suspended in a volatilizable carrier. The substrate is again fired to sinter the metal into a united mass and causing it to fuse only with the low temperature melting glass pattern. The unadhered portions of the metal coating are removed by a washing operation. An exclusively metallic layer is thereby formed on a high resolution glass pattern intermediate layer supported by the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.