Cryopump
US4454722A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 1982 |
| Grant date | Jun 19, 1984 |
| Priority date | — |
| Expiry date | Oct 29, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S417/901
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
For a given temperature differential between a refrigerated heat sink (28) and frontal cryopanel array (46), the mass of the entire cryopump array is minimized by providing thermal struts (54) between the heat sink and the frontal array. The thermal struts extend through, but are isolated from, the primary pumping surface to minimize their lengths. The struts support the frontal array independent of the side radiation shield to facilitate fabrication. To further reduce the temperature differential to the frontal array, heat pipes may be provided. Parallel heat pipes or solid thermal struts may provide the thermal path during cooldown of the system. By reducing the temperature differential between the frontal cryopanel array (46) and refrigerated heat sink (28) through the use of solid thermal struts or heat pipes the load carrying capability of a cryopump can be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.