Method of transfer lamination of copper thin sheets and films
US4455181A · kind A · utility
52Cited by
8References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 22, 1983 |
| Grant date | Jun 19, 1984 |
| Priority date | — |
| Expiry date | Feb 22, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12903
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A copper-clad laminate having special utility in the production of high resolution printed circuit patterns by either subtractive or semi-additive processing is made by vapor depositing a film of zinc on a copper film on a silica-coated aluminum carrier sheet, vapor depositing a silica film on the resulting zinc-copper foil, bonding the resulting body to a substrate and then stripping the silica-coated aluminum carrier sheet from the copper-clad laminate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.