Patent · US Expired

Method of manufacturing bodies of silicon nitride

US4455275A · kind A · utility

7Cited by
4References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 10, 1980
Grant dateJun 19, 1984
Priority date
Expiry dateOct 10, 2000

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC04B35/593
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

Bodies of silicon nitride are produced by enclosing a silicon nitride powder in a gas-tight glass casing and subjecting the casing to isostatic pressure using gas as a pressure medium at a temperature of at least 1600.degree. C. and a pressure of at least 100 MPa. The casing is a glass having a high softening point. The casing is evacuated and sealed before compressing. The product may be pre-formed by isostatic compacting at a pressure of at least 100 MPa at a temperature considerably below the sintering temperature. The casing is cooled at a rate of at most 1000.degree. C. per hour and at a pressure of not over 10 MPa.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.