Process for producing printed circuit boards
US4457952A · kind A · utility
18Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 1983 |
| Grant date | Jul 3, 1984 |
| Priority date | — |
| Expiry date | Apr 15, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1407
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
When an alkaline earth metal carbonate powder is mixed with an adhesive and is formed into an adhesive layer in a conventional covering method, a problem of the transfer of catalyst for electroless plating during a masking step or later electroless plating step is solved. Further, blisters under plated film caused by a fire retardant contained in an insulating substrate is also overcome by the use of alkaline earth metal powder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.