Hot melt adhesive compositions
US4460728A · kind A · utility
68Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 1983 |
| Grant date | Jul 17, 1984 |
| Priority date | — |
| Expiry date | Feb 28, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/678
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Hot melt adhesive compositions are prepared from ethylene copolymers, atactic polypropylene, tackifying resins and optional additives. The adhesives are non-pressure sensitive and are characterized by high cohesive strength, strong tack, and good heat, creep and cold resistance. In accordance with the preferred embodiment, the adhesives are formulated so as to be particularly adaptable for use in the construction of disposable diapers of the multi-line construction variety.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.