Ceramic substrate with integrated circuit bonded thereon
US4460916A · kind A · utility
11Cited by
3References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 1982 |
| Grant date | Jul 17, 1984 |
| Priority date | — |
| Expiry date | Oct 21, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0306
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A ceramic substrate, suitable for use as a circuit substrate on which integrated circuit chips are bonded, which consists essentially of, based on the weight of the substrate, 0.5.about.5.0% by weight of MgO, and 95.0.about.99.5% by weight of the total of Al.sub.2 O.sub.3 and SiO.sub.2, the proportion of the Al.sub.2 O.sub.3 to the SiO.sub.2 being in the range from 50:50 to 80:20 by weight.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.