Diamond saw
US4461268A · kind A · utility
20Cited by
7References
13Claims
0Family size
Inventor
Key dates
| Filing date | Jan 4, 1982 |
| Grant date | Jul 24, 1984 |
| Priority date | — |
| Expiry date | Jan 4, 2002 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D1/121
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A diamond saw for cutting hard materials, in which a steel plate is fixed with a sintered body consisting of diamond abrasive granules and a bonding metal powder, characterized in that a plurality of grooves having openings are provided at the edges of both the front and back side faces of said sintered body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.