Bondable polyamide
US4461805A · kind A · utility
3Cited by
0References
2Claims
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Assignee
Inventors
Key dates
| Filing date | Dec 5, 1983 |
| Grant date | Jul 24, 1984 |
| Priority date | — |
| Expiry date | Dec 5, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31757
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Self-bondable polyamides are prepared by reacting an aromatic diisocyanate or diamine with a mixture of terephthalic acid and an aliphatic dibasic acid having at least 6 carbon atoms. These self-bondable amides can also be used as topcoats for wires having basecoats of another polymer, e.g. a polyester, polyester-imide, or polyamide-imide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.