Process for making low fusion dispersion resins
US4461869A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 30, 1981 |
| Grant date | Jul 24, 1984 |
| Priority date | — |
| Expiry date | Dec 30, 2001 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F259/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
There is disclosed a process for producing low energy vinyl dispersion resins which, in a plastisol, can be fused either at lower temperatures or in a shorter period of time than the normal dispersion grade resins presently employed. The new vinyl resin is characterized by being a bimodal resin, i.e., containing large particles and small particles of polymer in a predetermined size and amount. The small particles are a vinyl homopolymer or copolymer made by a regular emulsion polymerization procedure. The large particles are a vinyl copolymer made employing a seeded emulsion overpolymerization procedure wherein the seed is either a vinyl homopolymer or a vinyl copolymer. The final bimodal resin is obtained from a blend of the small and large particle latices by drying, such as spray drying, for example.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.