Patent · US Expired

Method of forming a multilayer thin film

US4462881A · kind A · utility

9Cited by
3References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 18, 1981
Grant dateJul 31, 1984
Priority date
Expiry dateNov 18, 2001

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01F41/34
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A method of forming a multilayer thin film is disclosed in which a second thin conductive film is deposited on a first thin conductive film uninterruptedly after the first thin film has been deposited on a substrate, the first and second films thus formed are processed so as to form a predetermined pattern, the surface of the second thin film is cleaned by ion etching and a third thin conductive film is deposited on the whole surface of the substrate, and then the second and third thin films are processed so as to have a pattern different from the above-mentioned predetermined pattern. In the case where two thin conductive films different in material and pattern from each other are piled on a substrate, the above method can form a perfect interconnection between the two films and can make very small the contact resistance between the two films. Accordingly, the method is fit to form, for example, a barber pole type magnetoresistive element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.