Unsaturated polyester molding compounds with improved resistance to thermal and humid aging
US4465806A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 16, 1983 |
| Grant date | Aug 14, 1984 |
| Priority date | — |
| Expiry date | Feb 16, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/922
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The compositions disclosed herein comprise a mixture of: PA1 (1) An unsaturated polyester resin; such as the polymeric ester of maleic acid or anhydride and a glycol such as ethylene glycol; and PA1 (2) The reaction product of a polyepoxy compound, such as the diglycidyl ether of bisphenol-A, and an unsaturated monocarboxylic acid, such as acrylic or methacrylic acid, in which reaction product there remains unreacted at the time of mixing with said polyester resin at least 5 percent of the original epoxy groups of said polyepoxy compound. This mixture when molded or cured gives improvement with respect to thermal and humid aging as compared to similar compositions in which the epoxy groups of said reaction product are substantially all reacted prior to mixture with said unsaturated polyester resin. The flexural strength, in particular, of the compositions are better retained on aging without adverse effect on other properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.