Patent · US Expired

Substrateless thermoelectric device and method of making same

US4465894A · kind A · utility

19Cited by
3References
21Claims
0Family size

Assignee

Inventor

Key dates

Filing dateApr 7, 1983
Grant dateAug 14, 1984
Priority date
Expiry dateApr 7, 2003

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10N10/17

Abstract

A new and improved thermoelectric device of the type which provides electrical energy in response to a temperature gradient applied across the device exhibits both structural integrity and improved efficiency. The new thermoelectric device includes a plurality of thermoelectric elements, coupling means on opposite respective sides of the thermoelectric elements for interconnecting the elements electrically in accordance with a predetermined pattern, and encapsulant means including an encapsulant material covering the exposed surfaces of the thermoelectric elements. The encapsulant forms void spaces between the elements for providing effective thermal insulation between the elements and confining substantially all of the heat flow from the temperature gradient to through the elements. The coupling means includes electrically conductive plate segments for electrically interconnecting the thermoelectric elements. The plate segments are joined to the elements on respective opposite sides thereof and are contacted and held in fixed relative relation by the encapsulant material. The plate segments further define an outer periphery of the device and the encapsulant material bridge across …

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.