Process of producing copper-alloy and copper alloy plate used for making electrical or electronic parts
US4466939A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 1983 |
| Grant date | Aug 21, 1984 |
| Priority date | — |
| Expiry date | Sep 22, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22F1/08
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
This invention provides an economic copper-nickel alloy having high strength and high conductivity for lead conductor materials and/or lead frames for transistors, integrated circuits, and the like. The copper alloy comprises a composite of copper and inexpensive elements comprising 3.0% by weight nickel; from 0.01 to 1.0% by weight silicon; and from 0.01 to 0.1% by weight phosphorus. In one preferred embodiment a specific weight % of iron is also added. Still further, an improved method is provided for fabricating the alloy according to a specific series and sequence of steps, including steps at specific conditions and for specific times, for providing precipitation hardening. Other advantageous properties comprise desirable elongation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.