Elastomer modified bis-maleimide resin
US4468497A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 1983 |
| Grant date | Aug 28, 1984 |
| Priority date | — |
| Expiry date | Jan 24, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2379/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A novel bis-imide matrix resin system especially useful for high temperature, high performance, graphite fiber composites is disclosed. Microcracking of composites is reduced and transverse strength is increased by the addition to the resin system of 1 to 15 percent of compatible elastomers, such as polyether sulfones, bis-phenol linear homopolymeric epoxies or polyacrylic esters. The resin system comprises 50 to 95 percent by weight of ethylenically unsaturated bis-imides, preferably a low melting mixture of a major portion of maleimides of aromatic amines with a minor portion of maleimides of an aliphatic amine and 5 percent to 35 percent by weight of a diunsaturated low-temperature cross-linking agent such as divinyl benzene which gels the bis-imide at low temperatures. Room temperature tackiness, heat resistance and cross-link density are improved by the presence of 1 to 10 percent of a trifunctional curing agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.