Copper electroplating process
US4469564A · kind A · utility
103Cited by
7References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 1982 |
| Grant date | Sep 4, 1984 |
| Priority date | — |
| Expiry date | Aug 11, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/241
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A copper electroplating process is described in which the anode is surrounded by a cation-permeable membrane so as to prevent decomposition of additives in the electrochemical bath. Such a feature adds to bath lifetime and permits better control of bath chemistry and plating quality during the electroplating process. The feature is especially advantageous for copper electroplating processes using nonconsumable electrodes because of the high consumption of additives and that the copper can be added to the cathode side of the membrane so that acid copper ions need not pass through the membrane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.