Composition for bonding electroconductive metal coating to electrically nonconductive material
US4469714A · kind A · utility
15Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 2, 1983 |
| Grant date | Sep 4, 1984 |
| Priority date | — |
| Expiry date | Sep 2, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0236
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention provides a composition comprising about 15 to about 75% by weight of a thermosetting or ultraviolet-curable resin, about 24.5 to about 84.5% by weight of finely divided heat-resistant inorganic substance and about 0.5 to about 20% by weight of a finely divided palladium catalyst. This composition is the solvent-free type and useful for forming an electroconductive metal coating on an electrically nonconductive base material by chemical plating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.