Method for controlling the edge gradient of a layer of deposition material
US4469719A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 21, 1981 |
| Grant date | Sep 4, 1984 |
| Priority date | — |
| Expiry date | Dec 21, 2001 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/044
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for controlling the slope of the edge gradient of a layer of vapor deposition material onto a substrate from an evaporation source of vapor deposition material comprising the steps of forming a flux of vapor deposition material having an effective source cross-sectional area and shape from an evaporation source of a vapor deposition material located at a known position, indexing a deposition mask having a plurality of apertures extending therethrough such that the mask is in a spaced relationship from the source defining a source-to-mask distance and positioned in the flux of vapor deposition material to permit the flux of vapor deposition to pass through the apertures, registering a substrate in a spaced relationship from the deposition mask defining a mask-to-substrate distance to permit the flux of the vapor deposition material passing through the apertures in the deposition mask to impinge onto the substrate forming a layer of vapor deposit material thereon, controlling at least one of the effective source cross-sectional area and shape of the flux of vapor deposition material, position of the evaporation source of a deposition material relative to the deposition mask,…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.