Poly(butylene terephthalate) based molding resins
US4469834A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 1983 |
| Grant date | Sep 4, 1984 |
| Priority date | — |
| Expiry date | May 11, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/03
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
There is provided an improved molding resin capable of being molded into an article exhibiting reduced tendency to corrode a copper surface when the molded resin and the copper surface are placed in spaced relationship in a common unventilated atmosphere at elevated temperatures, as measured by the Bell Telephone Laboratories Copper Corrosion Test at temperatures within the range of from 150.degree. to 175.degree. C., wherein the molding resin comprises the combination of (a) a poly(butylene terephthalate) based polymer and aromatic halogen groups in a flame retardant amount, and (b) an alkylhydroxyphenylalkanoyl-hydrazine in an amount that is within the range of from 0.05 to 0.6% by weight, based on the weight of the molding resin, and less than 0.8% by weight based on the polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.