Interconnection construction to thick film substrate
US4470648A · kind A · utility
16Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 1982 |
| Grant date | Sep 11, 1984 |
| Priority date | — |
| Expiry date | Dec 27, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01078
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integral lead frame for a thick film substrate mounted in a housing has three portions. A first portion in the interior of the housing contacts the thick film substance with stress relieved terminals having an arcuate hoop and reduced width. A second portion includes vertical steps for changing the plane of the lead frame. The third portion includes a connector blade with a thickness greater than the terminal thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.