Low profile integrated circuit electrical socket assembly
US4470649A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 1982 |
| Grant date | Sep 11, 1984 |
| Priority date | — |
| Expiry date | Jun 23, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49151
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The low profile integrated circuit electrical socket assembly includes a drawn metallic socket (A) into which a leaf spring insert (B) is press fit. The socket includes a hollow upper body portion (10), a hollow lower body portion (12), a transition portion (14) interconnecting the upper and lower body portions, and a radial flange (16) at the inlet end of the upper body portion. A lead receiving passage (18) is defined longitudinally through the upper body portion and into the lower body portion. The socket is inserted through an aperture (60) of a dielectric board (C) with the flange abutting one board surface (62) and the transition portion disposed outwardly adjacent the opposite surface (64). An axially compressive force is applied between the flange and the transition portion in such a manner that the transition portion is deformed radially outward into a retaining collar. In this manner, the flange and collar hold the socket securely in the dielectric board. Leads (72) of an electric component (D) extend into the axial lead receiving passage in electrical and frictional engagement with the socket and leaf spring insert.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.